ˇ@

Multilayer PCB RF/microwave PCB Metal Bonded PCB Microvia PCB IC substrate Back to Product

ˇ@

IC

industry leads the electronics industry to higher density. The IC package technology has turned to organic substrate since its first launched BGA package since 1990.

It became an opportunity for PCB fabricator to get involved into this fast growing market. BoardTek start developing PBGA substrate since early 1996. In 1998, BoardTek transfer technology from Japanese firm Nihon Micron and founded a new company named Chipstrate Technology (CST). To fit in this market segment, CST is more focused in RF/PA module, LF-BGA, FC-BGA and some SIP module. CST was merged into BoardTek in Nov.2002.

ˇ@

ˇ@

ˇ@

ˇ@

ˇ@

Laminate material - capable for many high performance laminate like GETEK, BT, High Tg FR-4 or FR-5, ceramic-contained PTFE (Arlon AR-1000), PPEˇK

Core thickness - process thinner laminate down to 0.1 mm (0.004").

Metal finishing - specialize in bondable gold for gold wire bonding. It can be achieved by electrolytic or immersion thick soft gold. Selective metal finishing is also available.

Fine line capability - 75 micron (3 mil) line/space is standard capability. CST can also provide 60/60 micron or finer line/space in its class 1000 clean room.

** To contact CST, you may contact BoardTek or via e-mail to hy@mail.boardtek.com.tw