General
description
To support our customer to build power amplifier for base station application, Boardtek developed metal bonding technology for many years. To meet customer・s specification, we can provide many kinds of technologies.
Prebond metal backed PCB
Boardtek can drill through very thick copper plate by standard PCB drilling machine. To reduce drilling cost, depth control drilling and plating is also possible. We also own twelve milling machine in house to machine copper, brass or aluminum backed laminate.
Multilayer PCB bonded with prepreg
The limitation of metal backed board on single layer pattern can be overcome by bonding the mixed dielectric multiplayer PCB to metal plate by PCB lamination process. The grounding can be achieved by plated through hole.
Sweat bonding
Sweat bonding means to bond PCB with metal by soldering process. The solder paste is stencil printed to the metal first. A solder reflow process bonding the PCB and metal together, then. The solder with high melting point can stand for the component assembly process without affecting its bonding force. Boardtek specialize the sweat bonding process. We developed our own automatic bonding machine to get high yield rate, consistent quality and high throughput. One advantage of using sweat bonding is to reduce the material cost by bond small metal coin(s) in a big PCB mother board.
Metal bonded by electrical conductive film
One popular metal bonding method for base station PA is to use electrical conductive film to bond PCB and metal plate. The most common material is CF-3350 (or Ablefilm) supplied by Emerson & Cuming. Boardtek also has long time experience to produce the metal bonded PCB by Ablefilm bonding.
IMS (Insulated Metal Substrate)
It・s more like metal prebonded board. The material suppliers coated a high thermal conductive layer on the metal (aluminum) plate and then laminate a sheet of copper foil on the surface. It・s quite popular for LED application now. The manufacturing process is simple for Boardtek and we can use our China factory to help our customer reducing the cost
Coin insertion technology
It・s a new technology for Boardtek. We tried to put a copper coin inside the MLB. This small coin size can be tiny with dimension 5 mm x 5 mm. It can be flat to both sides of PCB. It can also electrically conductive with some ground layer. To fit our customer・s design needs, the PCB constructions have multiple phase. More idea has been launched and tested.
