Multilayer PCB RF/microwave Metal Bonded PCB Microvia PCB IC substrate

 

 

General description
High power consumption needs drives metal bonded boards growing fast. BoardTek develops many different technology to meet customers demand. Both pre-bonded and post-bonded PCB can be processed to meet customer's requirement.
Bonding material: prepreg, thermal conductive resin (Thermagon, Berquist), Electrical conductive resin (Flexlink, Ablefilm), Solder
Metal material: Aluminum, Copper, Brass
Depth control: +/-0.002"
Registration: +/-0.002"

Pre-bonded metal back PCB
BoardTek is capable in making metal backed PTFE PCB which is pre-bonded by laminate supplier like Arlon, Rogers or Taconic. The board is drilled and plated through with depth control milling to meet customer's specification.

Thermal conductive resin bonded metal PCB
PCB is electrically isolate to metal. The dielectric material for bonding have very high thermal conductivity compare with FR-4 or normal resin.

Electrical conductive resin bonded metal PCB
The back side ground plan can electrcially conducted to metal through electrcially conductive material. BoardTek transfer FLEXLINK technology from Poly Circuits. The Flexlink II material composed of metal powder and silicon, which has been approved in improving board flatness after bonding. We can also provide metal PCB bonded by other bond film vendor like Ablestik.

 

Sweat Bonding metal PCB
We can "solder" PCB to the metal parts by eutectic solder or high temperature solder like 90%Pb-10%Sn, 95%Sn-5%Sb or other composition solder. So that the ground plan in the backside can electrically conductive to metal carrier.

 

Metal core PCB
For better thermal dissipation and still keep double sided component attachment, we can build the circuit board have a thick metal inside the PCB. It can be one metal layer and connect to the thermal pad via plated through hole, or thermal vias.

 

Metal PCB bonded by FR-4 prepreg
BoardTek can build PCB bonded with metal through conventional multilayer process. It consist of plated through thick metal, depth control milling, blind/buried vias, hole plugging and other options.