B

¡@

Multilayer PCB RF/microwave PCB Metal Bonded PCB Microvia PCB IC substrate

oardTek starts microvia PCB development since 1998. Not only for portable electronics like cellular handset, we also service for different applications like IC substrate,CPU module
card, Bluetooth test kit and medical equipment.

¡@

¡@

¡@

¡@

¡@

Normal laser via
BoardTek produce microvia PCB by CO2 laser drilling machine. Drilling process is accomplished by conformal mask method. The dielectric can be resin coated foil (RCC), Thermount or laser ablatable prepreg. 1+n+1 is standard. 2+n+2 can also be produced with less capacity and lower yield. Different stack via process is available. Please contact us for more information.