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ultilayer PCB is BoardTek's main product. To differentiate with most of the PCB shop in Taiwan or Asia, BoardTek take a lot of effort in R&D to fulfil our customer's
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High
performance laminate material
BoardTek can process various material for different application. It includes
High Tg, low Dk, low loss, low water absorption like GETEK, Polyimide, Cyanate
ester, BT, PPE, and many others. We also specialize in mix-dielectric (or hybrid
dielectric) multilayer (Please refer to RF/microwave PCB)
High
speed circuits or impedance control PCB
BoardTek worked for high speed module like Rambus memory module (RIMM) for many
years. We can control the circuit characteristics in single-ended as well as
differential impedance control with very tight tolerance (see below). For some
application like RIMM, we also control the delta impedance (£GZ0), propagation
delay (Tpd), and £GTpd by monitor the laminate dielectric constant and thickness.
Blind/buried
via PCB
For high density PCB application, BoardTek can build multilayer board by sequential
lamination and laser via (please refer to Microvia
PCB )
Heavy
copper
BoardTek can process multilayer PCB with very thick copper foil in inner or
outer layer for high power PCB application.
High
layer count
BoardTek keep working with our customer in high layer count multilayer PCB.
To improve the layer-to-layer registration, we installed the pin lamination
system for this purpose. BoardTek is also plan to setup a new wet process line
to increase the board thickness up to 0.25" or even higher.
Capability
|
Specification |
Standard
|
Critical
|
| Layer count |
2~22
|
28~32
|
| Minimum Line/space |
4/4
|
3/4
|
| Minimum innerlayer core thickness |
0.004"
|
0.003"
|
| Minimum finished hole size(Mechanical drilling) |
0.008"
|
0.006"
|
| Minimum finished hole size (Laser drilling) |
0.004"
|
0.003"
|
| Maximum aspect ratio (conventional) |
6:1
|
10:1
|
| Maximum aspect ratio (laser via) |
0.5:1
|
0.7:1
|
| Hole size dimension tolerance |
+/-0.003"
|
+/-0.002"
|
| Minimum pad size (mechanical drilling) |
0.018"
|
0.016"
|
| Minimum pad size (laser drilling) |
0.014"
|
0.012"
|
| Maximum board thickness |
0.250"
|
0.275"
|
| Minimum board thickness (2L) |
0.010"
|
0.005"
|
| Minimum board thickness (4L) |
0.016"
|
0.012"
|
| Minimum board thickness (6L) |
0.022"
|
0.018"
|
| Minimum board thickness (8L) |
0.028"
|
0.024"
|
| Maximum copper foil thickness (IL) |
4 oz
|
5 oz
|
| Maximum copper foil thickness (OL) |
5 oz
|
8 oz
|
| Impedance control tolerance |
+/-10%
|
+/-6%
|
| Maximum panel size |
18" x 22"
|
22" x 28"
|
| Contour routing dimension tolerance |
+/-0.005"
|
+/-0.003"
|
| Depth control routing tolerance |
+/-0.004"
|
+/-0.002"
|
Others:
Laminate material:
FR-4, high Tg FR-4, FR-5, GETEK, BT, Polyimide, PPE, PTFE(Teflon), Polyester
(GIL), Cyanate ester, Green laminate (halogen free), Ohmega-ply, Resin coated
copper foil (RCC), Thermal clad, T-clad
Surface finishing:
HASL, OSP, immersion Ni/Au, bondable Ni/Au, immersion Ag, immersion Sn
Special offer:
Castellation, multi-tier, pin insertion, selective plating, press-fit, edge
plating¡K