oardTek is proud in various technical capability which used in different electronics products. When combine these technologies together, BoardTek can give customers

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very flexible PCB manufacturability to fit their design needs. BoardTek can also provide ideas during their design stage. Our solution can easily fit the electronics industry for their high density, high power, high speed, high frequency and low cost.

Multilayer PCB RF/microwave PCB Metal Bonded PCB Microvia PCB IC substrate

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Multilayer PCB - BoardTek provide higher layer count, blind/buried vias, high performance material, heavy copper foil, impedance control, edge plating, multi-tier, castellation¡K into traditional multilayer PCB.

RF/Microwave PCB - BoardTek is one of the major PTFE PCB suppliers in Asia. To meet the growing market, BoardTek specialized in high volume production for mixed dielectric, metal-backed, long antenna¡K for power amplifier, LNB, antenna, transmitter, VSAT, LMDS¡Kproducts.

Metal Bonded PCB - BoardTek specialize in different metal bonded PCB. It can be pre-bonded or post-bonded. It also can be bonded by thermal conductive, electrically conductive, normal FR-4 prepreg or even "soldered" by tin-lead or leadless solder.

Microvia PCB - BoardTek installed the first laser drilling machine since 1998. Since then, we develop high density PCB for portable electronics, high density module, IC substrate and high layer count back panel.

IC substrate - IC substrate like PBGA, CSP, Flip Chip BGA is one of the fastest growing market in PCB industry. More and more IC package starts using organic substrate for their lower cost for high volume production.