oardTek is proud of various technical capability which used in different electronics products. When combine these technologies together, BoardTek can give customers

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very flexible PCB capability to fit their design needs. BoardTek can also provide ideas during their design stage. Our solution can easily fit the electronics industry for their high density, high power, high speed, high frequency and low cost.

Multilayer PCB RF/microwave PCB Metal Bonded PCB Microvia PCB Back to Product

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MLB - Boardtek made multilayer PCB since we founded 20 years ago. Today, MLB is still our main products. We service our customer MLB from prototype to mass production. The application covered industry servers, workstation, network, base station, backplanes, power supply, industrial computer, industrial equipment, test machine and consumer products.

RF PCB - Boardtek is one of the biggest RF/Microwave PCB producer in the world. Our technologies and quality have been approved by many big customers globally. Besides, we work with our customer to develop new process to further reduce the PCB cost. Boardtek specialized in processing exotic material in house. From PTFE, Rogers, to low Dk FR-4, from heavy ceramic loaded high Dk to pure Teflon laminate, Boardtek made PCB from prototype to high volume production. The application covered cell phone base station PA, point-to-point transceiver, antenna module, LNB, RF SMD components, VSAT¡Ketc.

Metal Bonded PCB - To support our customer to build power amplifier for base station application, Boardtek developed metal bonding technology for many years. To meet customer¡¦s specification, we can provide many kinds of technologies.

HDI PCB - Boardtek install the laser drilling machine in late 90¡¦s. On that time, very few Taiwanese fabricators own drilling machine yet. With almost 10 years experience in HDI (microvia) PCB production experience, Boardtek did not make high volume HDI PCB for cellular phone or other hand-held products. Due to low volume capacity in laser drilling equipment, we are more focused on support our existing customer in low volume products. To fit our customer needs in via-in-pad demand, we developed microvia filling capability either by resin or by plating.