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Chipbond
Technology
Corporation |
Introduce: Chipbond Technology Corporation (Chipbond) is established in January 1997. As a company devoted to wafer bumping and associated packaging and assembly operations for the semiconductor industry, Chipbond moved into present address in the Science-Based Industrial Park in HsinChu, Taiwan in May, 1997. The Chipbond management team has extensive experiences in both front-end and back-end of the semiconductor business.
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| Tel:886-3-5678788 | Fax:886-3-5638998 | |
| Addr:No.
1-6, Li Hsin I Rd, Science-Based Industrial Park Hsinchu, Taiwan, R.O.C |
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| http://www.chipbond.com.tw/ | ||
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Advance
Materials
Corporation |
Introduce: Advance Materials Corporation (AMC) Founded on Sept.15, 1998 and strives to supply the most advanced PCB and substrates available by offering high Tg prepregs/laminates(Tg from 150 to 220'C), no-flow prepreg, and custom made products. AMC products apply items such as notebook motherboards, HDI, Rambus, burn-in, and heat-sink, AMC is also licensed by IBM to produce Driclad laminates for PBGA, Flip Chip packaging, and high layers PCB (up 36 layers).
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| Tel:886-3-3246000 | Fax:886-3-3245989 | |
| Addr:498-2
Nan San Rd., Sec 2., Luchu Taoyuan Hsien, Taiwan, R.O.C |
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| http://www.amcorp.com.tw/ | ||
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Chip
Cera Technology
Corporation |
Introduce: Chip Cera Technology Corporation (Chip Cera) Founded on Dec., 2000 and Focus on MLCC.
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| Tel:886-7-8112832 | Fax:886-7-8418351 | |
| Addr:No.
9-2 , West 1st ST, K.E.P.Z. Kaohsiung, Taiwan, R.O.C |
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Boardtek
Scandinavian Office
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Introduce:
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Tel: +46-19-26 99 46 |
Fax: +46-19-26 99 38 |
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| Addr:Boglundsgatan 2, Box 1910, SE-701 19 OREBRO, Sweden | ||
| Kent Tornkvist | ||
