Research
Achievements and R&D Projects
I. Boardtek Research Vision
Dedicate efforts to the critical techniques and processes development of PCB and IC substrate fabrication, to provide products to the niche market of special applications of high density、high frequency、high speed or high power dissipation, and to be a technical oriented provider in the field of PCB and IC substrate。
II. Research Achievements
1.
Manufacturing
Technology for High Density and High Speed Printed Circuit Board.
l
Manufacturing Technology for High Layers Backplane(24 Layers)
l
Manufacturing Technology for High Speed Memory Module
To meet the specifications of Rambus Memory Module is very critical. The bus clock is high up to 800MHz and the parallel signal lines are over 100， The impedance difference among these parallel signal lines should be limited to very small tolerance，otherwise the module can not perform proper functions。
l
Manufacturing
Technology for Laser Via HDI PCB
2.
Manufacturing
Technology for Microwave Communication Products
In order to reduce signal loss and noise, microwave communication products use the material with low dielectric constant and low tangent loss for PCB and substrate. The manufacturing technology for this kind of materials is different from that for the conventional PCB. BoardTek has many years experience to handle this kind of materials and developed a sweat bonding technology to bind PCB and metal plate to deal with high power dissipation problem.
l Manufacturing Technology for Low Tangent Loss Substrate
l
Manufacturing
Technology for Mixed Dielectric Materials PCB.
l
A Collection of Microwave Products made by Boardtek
Remarks:
1.VSAT: Very Small Aperture Terminals,
for satellite communication use.
2.RF PA: Radio Frequency Power Amplifiers
3.LNB: Low Noise Block Down-Converter,
for satellite communication use.
4.Tx/Rx: Transmitter/Receiver
3. Manufacturing Technologies for Photo Image Products
lManufacturing
Technology for CMOS Image Sensor Substrate
l Manufacturing Technology for High Power LED Substrate
l
A Collection
of Photo Image Products
4. Equipment
Development
l
Development
of a production line for Automatic Sweat Bonding
l
Development
of a vertical pulse copper plating line
In order to plate high aspect ratio through
holes and fill up blind vias, BoardTek
put effects on vertical pulse copper plating study, and developed the
relative equipment such as pulse plating power suppliers and inert anode.
III. R&D Projects：
The
R&D projects of Boardtek can be divided into three aspects:
1.Production processes improvement:
the
subjects include pulse copper plating、design and fabrication of inert anode for
copper plating.
l
Pulse Plating Research
Common PCB copper plating process
uses direct current for plating. To high aspect ration through holes,
the dog bone shape will form at the corner of the holes. To eliminate
this phenomenon, BoardTek
put effects on pulse plating technology. For blind via plating, pulse
plating can also fill up the vias。
l
High Current Pulse plating Power Supplier Development
In order to perform pulse plating
effectively, BoardTek developed High Current
Pulse Plating Power Supplier.
lDesign and Fabrication of Inert anode for copper plating
2.Advanced technology development：
which
involve two projects currently：
l
Develop the crucial technology for System in Package with Embedded Components
As
thinner and smaller of electronic device, shrinking the volume and reducing
the number of components become the key issues of design and application
of electronic device. System in Package has many advantages of shrinking
the package area、increasing speed、shorten the developing duration
and reducing the cost. It has become a main stream package to substitute
the conventional packages. Integrated SIP emphasizes high performance
and highly integration. Passive components are embedded into the substrate. Eventually, SIP may involve active components
and optical transmission device into the substrate. Boardtek has many years experience about
embedded resistances. Currently,Boardtek
is working with Uniplus and ChipBond
to develop the crucial technology for System in Package with Embedded
Components. This project has been granted a subsidiary from Ministry
of Economical Affair to support the research. It will develop new material
for shrinking the area of capacitances and non-halogen and non-phosphorous
material for resistances. This technique can be used for
l
Develop EMI shield screen for Plasma Display Panel
Boardtek
is arranging a project with CSIST about the design and fabrication of
EMI shield screen for PDP. The screen should have both highly transparent
and EMI shield properties. This technique can be applied to Display
Technology and also can be applied to the need of EMI shield.
2.
Resources recovery：
3.
which
contains the recovery copper from acid copper etching waste and the
recovery copper from microetch waste.
l
Copper Oxide recovery Technology
from acid etching waste:
Etching and plating processes are inevitable for PCB
manufacturing. During the etching process, copper are taken off copper
foil to form copper ion in the etching solution. And the plating process
put copper ion back to copper foil. We have to treat etching waste and
buy copper ball for plating. If we can covert the copper ion in the
etching solution to a usable form for plating, it may eliminate etching
waste treatment and reduce the impact to environment. It also save
costs.
l
Noble Metal Recovery Technology:
For high end products, The Nickel Gold plating process is used for metal finish treatment. The waste gold plating solution contains high concentration gold ion, Boardtek is developing a process to recovery the gold ion for resource recovery and cost saving.